• Vacuum Pumps
  • Rotary Vacuum Pump
  • Rotary Vacuum Piston Pump
  • Diffusion Pump
  • Roots Pump
  • Diaphragm Pumps
  • Oil Lubricant Vacuum Pumps
• Vacuum Pumping System
• Vacuum Guages
  • Analogue Pirani Guage
  • Analogue High Pressure Pirani Gauage
  • Analogue Penning Guage
  • Digital Pirani Guage
  • Digital High Pressure Pirani Gauge
  • Digital Penning Guage
• Gas Mixing Cum Sensing System
  • Gas Mixing System
  • Gas Sensing System
• Mass Flow Controller
• Vacuum Components & Hardware
  • Vacuum Components
  • Vacuum Valves
• Thermal & Electron Beam Gun Deposition System
• RF & DC Sputtering System
• SEM Sputter Coater
• Ion Assistant Deposition Systems
• CVD System
  • CVD System
  • PECVD System
• Plasma Etch System
• Atomic Layer Deposition System
• Spin Coater
• Dip Coater
• Langmuir Blodgett System
• Deposition Materials
  • Sputtering Targets
  • Evaporation Materials
  • Ceramic Materials & Other Consumables
• Cryostate
• Magnetic Stirrer
• Hot Plate
• Auto Clave
• Centrifuge
• Cooling Refrigerator

PECVD System

Plasma Assisted Chemical Vapor Deposition (PECVD) involves forming solid deposits by initiating chemical reactions in a gaseous discharge. The discharge can be excited by using either RF, microwave or photonic excitation. It produces a wide variety of chemical species in ionised and excited states, free radicals as well as ions and electrons. The nature, type, concentration and energy of these species determine the growth and properties of the films.

Vacuum Chamber:

Electro polished 304 stainless steel having 2 Nos. View Ports of 4” Size.
Chamber is water Cooled.

Vacuum Pumping System

• Rotary and Turbo Molecular Pump to achieve ultimate vacuum in the range of 10E-6 mbar and working vacuum between 2 m bar to 0.3 m bar (2000 micron to 300 micron).
• Roughing/Backing/High Vacuum Gate Valve/ Throttle Valve
• Microprocessor controller based combined Pirani and penning guage

Features:

• RF Electrode for plasma
• 13.56 MHz RF power supply with Auto matching Network ( 300W or 600W )
• Gas Shower
• 4 Nos. Mass Flow Controllers with flow range upto 200 sccm
• Substrate Holder
• Substrate Heater
• Scrubber System
• Manual Control or Automatic

Control System: Manual or Automatic with PLC and SCADA based

Automatic Control Features:

• PC Base + PLC + Touch monitor
• Recipes, historical storage.
• Fully PC-based automatic operation with full manual override.
• Easy-to-use computerized touch panel for parameter control and recipe entry/storage.
• Authorities enactment with user name and password control.
• Safety mechanism (Interlock Mechanism).